Download e-book for kindle: Design-for-Test and Test Optimization Techniques for by Brandon Noia,Krishnendu Chakrabarty

By Brandon Noia,Krishnendu Chakrabarty

This ebook describes leading edge strategies to deal with the checking out wishes of 3D stacked built-in circuits (ICs) that make the most of through-silicon-vias (TSVs) as vertical interconnects. The authors establish the most important demanding situations dealing with 3D IC trying out and current effects that experience emerged from state-of-the-art learn during this area. insurance comprises subject matters starting from die-level wrappers, self-test circuits, and TSV probing to test-architecture layout, try scheduling, and optimization. Readers will reap the benefits of an in-depth examine test-technology recommendations which are had to make 3D ICs a truth and commercially manageable.

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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs by Brandon Noia,Krishnendu Chakrabarty


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